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Vertiv (NYSE: VRT), a global leader in critical digital infrastructure and continuity solutions, has unveiled three new models in its Vertiv™ CoolChip CDU (Coolant Distribution Unit) product line, marking a significant expansion of its direct-to-chip (DTC) liquid cooling solutions in Europe, the Middle East, and Africa (EMEA).
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The new models—CoolChip CDU 70, CoolChip CDU 100, and CoolChip CDU 600—are designed to support a broad range of AI, machine learning, and high-performance computing (HPC) deployments by delivering scalable, efficient, and adaptable cooling performance.
The Vertiv CoolChip CDU 600 will be showcased for the first time in EMEA at the Datacloud Global Congress in Cannes, highlighting Vertiv’s commitment to advancing next-gen thermal technologies.
“As data center workloads evolve, rack densities and thermal loads continue to rise,” said Sam Bainborough, VP of Vertiv’s EMEA Thermal Business. “Our expanded CoolChip CDU family offers scalable and flexible liquid cooling solutions that simplify deployment, reduce integration complexity, and support long-term growth.”
Overview of New Vertiv CoolChip CDU Models
Vertiv™ CoolChip CDU 70
- Type: In-row, liquid-to-air CDU
- Capacity: Up to 70 kW
- Ideal for: Retrofitting existing data centers or greenfield deployments
- Benefits:
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Fast and cost-effective entry into liquid cooling
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Leverages existing thermal infrastructure
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Reduces secondary fluid network complexity
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Integrated control system for real-time monitoring and coordinated performance
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Vertiv™ CoolChip CDU 100
- Type: In-rack, liquid-to-liquid CDU
- Capacity: 100 kW in a compact 4U form factor
- Ideal for: High-density workloads, incremental scaling, and AI pilot projects
- Features:
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Built-in filtration system and precise thermal control (±1°C)
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Physically separates IT and facility cooling loops
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Integrated monitoring for enhanced operational visibility
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Vertiv™ CoolChip CDU 600
- Type: In-row, liquid-to-liquid CDU
- Capacity: 600 kW for hyperscale and colocation environments
- Ideal for: Large-scale AI and HPC deployments
- Advantages:
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Supports raised-floor and retrofit installations
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Redundant pumps and top/bottom piping options
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Advanced temperature and fluid quality monitoring
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Internal manifolds available for simplified planning
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Supporting Scalable AI Infrastructure with Vertiv™ 360AI
The new CoolChip CDU models are part of the broader Vertiv™ 360AI portfolio, which includes power, cooling, and service solutions engineered to address the growing complexity of AI infrastructure. These systems are backed by Vertiv™ Liquid Cooling Services, providing global end-to-end support across the entire deployment lifecycle—from design and installation to fluid management and maintenance.
Vertiv’s liquid cooling portfolio is designed to scale with customer needs, whether retrofitting legacy facilities or building new high-density AI and HPC clusters.
